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Excellent Thermal Management Across Various Applications

KMT Sintec leverages internal manufacturing capabilities, supply partnerships, commercial channels and internal technical expertise to deliver standard &/or customized grades of boron nitride powder to a variety of end markets. hBN is prized for its excellent thermal, chemical stability and lubricating properties and is utilized an assortment of applications including: Thermal Grease (Heat dissipation), Thermal Plastics (heat dissipation), Release Agents for Al Castings.

The K-Series portfolio of thermally conductive boron nitride (BN) powders offers a range of physical properties to meet the most demanding requirements for thermal interface materials. BN powders inherently offer excellent thermal conductivity and electrical isolation, which are enhanced by the variety of grades suited for your specific processing requirements.  Learn more about Kennametal Sintec boron nitride powder product solutions below!

 

Download the Kennametal Boron Nitride Thermal Management Technical Datasheet

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Platelets

Description: Discreetly sized hexagonal BN platelets

General Properties: Highly thermally conductive (anisotropic) particles and individual platelets

Characteristics: Mean particles ranges from 10 – 40 µm, with a variety of surface areas and tap densities available

Benefits:

  • Compatible with silicone, resins and cosmetic formulations
  • Can be used in high shear mixing applications
  • Lubricous, thermally conductive, electrically isolating and very refractory
  • Non-Toxic and REACH certified

Applications:

  • Thermal plastics
  • Cosmetics
  • Paints & Coatings
  • Thermal interface materials
  • Electronic substrates
  • Solid lubricants
  • Mold release
     

Agglomerates

Description: Randomly Agglomerated BN platelets

General Properties: Electrically insulating and highly thermally conductive (isotropic) particles

Characteristics: Mean particles range from 120 – 230 µm, with a variety of surface areas and tap densities available

Benefits:

  • Better flowability than platelets
  • Isotropic thermal conductivity
  • Ideal for low-moderate shear mixing applications

Applications:

  • Thermal putties
  • Thermoset polymers
  • Break pad applications
  • Thermal phase change filler
  • LED substrates
  • Metal core boards

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