Downloaded file will be available after import in the {{cadTool}} tool library.
| Nr materiału | 6997635 |
| Nr katalogowy ISO | DNMG110412MV |
| Nr katalogowy ASI | DNMG333MV |
| Grade | KCP10B |
| [D] Insert IC Size | 9.525 mm |
| [D] Insert IC Size | 0.375 in |
| [D1] Insert Hole Size | 3.81 mm |
| [D1] Insert Hole Size | 0.15 in |
| [L10] Insert Cutting Edge Length | 11.628 mm |
| [L10] Insert Cutting Edge Length | 0.4578 in |
| [S] Insert Thickness | 4.76 mm |
| [S] Insert Thickness | 0.1875 in |
| [Rε] Corner Radius | 1.2 mm |
| [Rε] Corner Radius | 0.047 in |
Gatunki
KCP10B
Composition: A specially engineered cobalt-enriched carbide grade with thick MTCVD-TiCN-Al2O3-TiOCN coating for maximum wear resistance.
Application: An excellent finishing to medium machining grade for a variety of workpiece materials, including most steels, ferritic, martensitic, and PH stainless steels, and cast irons. The cobalt-enriched substrate offers a balanced combination of deformation resistance and edge toughness, while the thick coating layers offer outstanding abrasion resistance and crater wear resistance for high-speed machining. Smooth coating provides resistance to edge build-up and microchipping and produces excellent surface finishes.
Złóż nowe rozwiązanie aby obliczyc parametry posuwu i prędkości
Po złóżeniu rozwiązania wybierz ikonę "Posuwy i prędkości" a system pokaże rekomendowane wartości. Możesz doprecyzować wyniki dodając maszynę i jej specyfikacje lub zmień wartości początkowe Używając suwaki.
I have read and accepted the Terms & Conditions of use
CAD Drawings Models
Can’t find the file type you’re looking for?
Product data
Oznaczenie katalogowe ISO
Oznaczenie katalogowe ANSI
to find similar products.Please select a file to download
Models
. Please enter the desired qty for the material(s) you want to include in your promotion or Proceed Without Promotion and only your base materials will be added to the cart.
Minimum quantity should be
| SAP Material Number | Oznaczenie katalogowe ISO | Gatunek |
|---|
You are about to leave the Solution building process.
Are you sure you want to leave?