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| Material Number | 5517479 |
| ISO Catalog ID | RCGT190600ELFJ |
| ANSI Catalog ID | RCGT64ELFJ |
| Grade | KCSM30 |
| [D] Insert IC Size | 19.05 mm |
| [D] Insert IC Size | 0.75 in |
| [S] Insert Thickness | 6.35 mm |
| [S] Insert Thickness | 0.25 in |
| Average Chip Thickness [HM] | 0.051 mm |
| Average Chip Thickness [HM] | 0.002 in |
| Insert Number of Indexes | 6 |
Grades
KCSM30
Submicron substrate coated with high-performance TiAlN-PVD coating is an excellent choice for titanium, but also high-temperature alloys and stainless with higher speeds for light to medium cuts. First choice for application with thin to medium chip thickness, dry and wet.
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